Abstract: Temperature has an important influence on the wafer quality in the sapphire slicing process with fixed abrasive diamond wire saw. Temperature fields on the wafer surface during the slicing of sapphire ingot were studied with simulation and experiment. The effect of coolant on the slicing temperature field was explored. The simulation temperature field without coolant is good consistent with the experimental result. The maximum temperature located at the middle of slicing zone increase with the cutting depth. Coolant had a significant influence on the wafer temperature field. The narrow slicing kerf and wire movement have effect on the coolant supply, which cause the deviation of temperature field between the simulation result and experiment result.

Keywords: Slicing temperature, Wire saw; Sapphire wafer.