Laminated composite materials combine the performance advantages of various materials, and can form good comprehensive properties. For instance, thermal conductivity, electrical conductivity and flexibility. Composite materials have been widely used in many fields such as daily necessities, electronic products and medical instruments. This paper mainly studies the coupling problem of temperature field and force field of multilayer laminate materials. The material characteristics of the simulation experiment are: the composite material is anisotropic from the longitudinal view, and each layer belongs to the rectangular thin plate of theisotropic matrial from the transverse view. When heating on the contact surface of the laminated material, the local temperature will increase rapidly, and the thermal stress will be produced between the plates. The thermal stress expansion will have a great influence on the stability of the laminated plate and the deformation of the plate. Therefore, it is very important to establish a mathematical model of the coupling of thermal field and force field to simulate the change process of mechanical behavior of multilayer laminates under heating. Finally, according to the established multi-physical field model, the thermal stress cloud map and temperature diffusion process map of multilayer laminates are calculated and output. Our work enriched the multi-physical field theory and belonged to the process of combining the practical application of multi-layer composite materials with numerical simulation. It also makes the numerical calculation play a very good role in assisting and promoting industrial applications.