ICCM Conferences, The 7th International Conference on Computational Methods (ICCM2016)

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Simulation of thermoforming processes with anisotropic and visco-hyperelastic sheets of laminate
Peter G. Gruber

Last modified: 2016-06-05

Abstract


Many of daily life's digital gadgets are thermoformed devices, which are populated with electronic patterns (such as sensors, piezzos, screens, etc.), all of which are connected via an imprinted and dense path of conductors. Typical examples of such devices are game-controllers, parts of a mobile phone, or of a car's cockpit. In order to keep production cost low, and at the same raise the quality of the outcome, one innovative idea is to imprint patches and conductors to the laminated sheet even before it has been subject to the thermoforming process. Regarding the design of such devices it is clearly of essential importance to understand the overall behavior and predict zones of high stretches and strains of the sheet during the forming process. The design of an efficient and stable numerical simulation, which is the topic of this presentation, yields a valuable tool in assisting the real life experiment.

Keywords


computation; simulation; numerical methods

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